Polyimid Film Removal of Glass Wafer – Reclaim Process

NQW developed a reclaim process for Glass wafer with multi-layer, structured Polyimid (PI) Films. The process is based on an organic alkaline chemical solutions and an additional mechanical cleaning / polishing to remove the Polyimid Film from the surface of the glass wafer. The reclaimed glass wafers can be returned to the customer production process with no or a minimal loss on thickness. The customer used PI Technology with glass wafer for flexible integrated circuits (FlexICs). The FlexICs are a fraction of the cost of silicon based ICs, supporting a range of functionality including RFID and NFC.

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