The objective is to develop a joining technology at the wafer level that enables the production of glass/silicon/lithium tantalate composites with a TTV of less than 5µm in a material-friendly manner. Additionally, we aim to develop an analysis process for material-specific process requirements.

At a glance, your benefits include:

• Strong adhesion: silane-based monolayers guarantee exceptional bond strengths (up to 0.5 MPa*m¹/²).
• Ultra-thin functional materials: thinning down to 30 µm (LiTaO₃) and 50 µm (glass) for high-performance microchips
• Defect-free surfaces: Diamond-supported grinding and polishing processes guarantee optimum quality

Establish new benchmarks in microsystems technology through our advanced wafer bonding process.