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21.10.2019 00:00 - Polyimid Film Removal of Glass Wafer - Reclaim Process

NQW developed a reclaim process for Glass wafer with multi-layer, structured Polyimid (PI) Films...

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21. 10 2019
Category: Events

Polyimid Film Removal of Glass Wafer - Reclaim Process

NQW developed a reclaim process for Glass wafer with multi-layer, structured Polyimid (PI) Films. The process is based on an organic alkaline chemical solutions and an additional mechanical cleaning / polishing to remove the Polyimid Film from the surface of the glass wafer. The reclaimed glass wafers can be returned to the customer production process with no or a minimal loss on thickness. The customer used PI Technology with glass wafer for flexible integrated circuits (FlexICs). The FlexICs are a fraction of the cost of silicon based ICs, supporting a range of functionality including RFID and NFC.

For more information you may contact us at +49 (0)9101/ 90 220 200 or via email: info(at)nanoquarzwafer.com



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